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[THE INVESTOR] Samsung Electronics unveiled its plan to roll out next-generation mobile memory storage systems at a semiconductor forum in Seoul on Aug. 17.
The tech giant said that it would roll out an external universal flash storage card, dubbed UFS Card V2.0, and UFS 3.0, an internal memory chip.
Both memory products, which can respectively transfer 1.2 gigabytes and 2.4 gigabytes of data per second, are two times faster than their preceding products, the UFS V1.0 and UFS 2.0.
The tech giant said that it would roll out an external universal flash storage card, dubbed UFS Card V2.0, and UFS 3.0, an internal memory chip.
Both memory products, which can respectively transfer 1.2 gigabytes and 2.4 gigabytes of data per second, are two times faster than their preceding products, the UFS V1.0 and UFS 2.0.
They also have two times more storage capacity than previous models.
Samsung said it would mass produce the new memory chips by the second half of 2018.
The removable UFS V1.0 memory card is six times faster than a high-end micro SD card often used for smartphones, but consumes half the power.
“The conventional micro SD card, which has been in the market for the past 20 years, has an outdated structure,” said Cho Hee-chang, a senior researcher from Samsung Electronics’ memory business division, adding “The UFS, which can save power in a significant manner, is like a solid state drive for mobile drives.”
By Kim Young-won (wone0102@heraldcorp.com">wone0102@heraldcorp.com)
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